LTCC modules for power supply and IF circuitry in RF amplifiers

On the basis of the broad material system available for this work, the general goal is to study in how far the new materials will enhance the performance and miniaturization of functions in LTCC technology. The opportunities for further function integration are especially seen in the area of bypass modules for power supply and IF circuitry of RF modules. The required high capacitance and inductance values, could not up to now be integrated in LTCC due to the lack of sufficiently high dielectric constant materials and ferrites. The specific goals of this work are to: Characterize the new materials in the frequency ranges of interest for the new substrate integrated functions. Explore function design and modeling with these new materials and define optimized layouts for some selected functions. Give guidance to further material development based upon the understanding of how the integrated RF-functions can be optimized, and which material and technology characteristics play the central roles.