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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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Více o knize
The book addresses the complexities faced by package manufacturers in creating fine pitch thin packages with high lead counts that efficiently dissipate heat. It emphasizes the need for optimized structures, materials, and processes, alongside predictive measures to anticipate failures before production. With 95% of integrated circuits encapsulated in plastic for its cost-effectiveness and suitability for automated assembly, the evolution of packaging from basic DIP to advanced PQFPs and TQFPs is explored, highlighting a significant growth in demand projected for the near future.
Nákup knihy
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, Gerard Kelly
- Jazyk
- Rok vydání
- 1999
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Doručení
Platební metody
2021 2022 2023
Navrhnout úpravu
- Titul
- The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
- Jazyk
- anglicky
- Autoři
- Gerard Kelly
- Vydavatel
- Springer US
- Rok vydání
- 1999
- Vazba
- pevná
- Počet stran
- 164
- ISBN13
- 9780792384854
- Kategorie
- Elektrotechnika, Příroda všeobecně
- Anotace
- The book addresses the complexities faced by package manufacturers in creating fine pitch thin packages with high lead counts that efficiently dissipate heat. It emphasizes the need for optimized structures, materials, and processes, alongside predictive measures to anticipate failures before production. With 95% of integrated circuits encapsulated in plastic for its cost-effectiveness and suitability for automated assembly, the evolution of packaging from basic DIP to advanced PQFPs and TQFPs is explored, highlighting a significant growth in demand projected for the near future.