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Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.
Nákup knihy
Power Electronic Packaging, Yong Liu
- Jazyk
- Rok vydání
- 2012
- product-detail.submit-box.info.binding
- (pevná)
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Doručení
Platební metody
Navrhnout úpravu
- Titul
- Power Electronic Packaging
- Podtitul
- Design, Assembly Process, Reliability and Modeling
- Jazyk
- anglicky
- Autoři
- Yong Liu
- Vydavatel
- Springer-Verlag GmbH
- Rok vydání
- 2012
- Vazba
- pevná
- ISBN13
- 9781461410522
- Kategorie
- Elektrotechnika, Příroda všeobecně
- Anotace
- Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.