Milton Ohring Knihy

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films . The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

This book serves as a valuable reference for reliability professionals and a text for advanced undergraduate or graduate students, introducing the extensive reliability literature related to microelectronic and electronic devices. It addresses chip and packaging level failures, linking them to atomic mechanisms and models that explain degradation, alongside the statistical analysis of lifetime data. Key failure mechanisms discussed include electromigration, dielectric radiation damage, and mechanical failures of contacts and solder joints. A central theme is the relationship between product defects, yield, and reliability, emphasizing their role in failures and methods for experimental exposure. Readers will enhance their understanding of failure mechanisms in electronic materials and devices, develop skills in the mathematical handling of reliability data, and gain insights into future technology trends and associated reliability challenges. Key features include discussions on reliability and failure at both chip and packaging levels, the impact of defects on yield and reliability, a tutorial on reliability mathematics, and a focus on various failure mechanisms and defect detection methods.